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dc.rights.licenseopenen_US
dc.contributor.authorNIDHIN, K.
dc.contributor.authorBALANETHIRAM, Suresh
dc.contributor.authorNAIR, Deleep
dc.contributor.authorD'ESPOSITO, Rosario
dc.contributor.authorMOHAPATRA, Nihar
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorFREGONESE, Sebastien
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorZIMMER, Thomas
IDREF: 076632598
dc.contributor.authorCHAKRAVORTY, Anjan
dc.date.accessioned2023-02-27T11:10:20Z
dc.date.available2023-02-27T11:10:20Z
dc.date.issued2022-10-27
dc.identifier.issn0018-9383en_US
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/172104
dc.description.abstractEnA prior estimate of the impact of thermal resistance from the back-end-of-line (BEOL) metallization layers is crucial for an accurate circuit design and thermally aware device design. This paper presents a robust technique to extract the thermal resistance component originating from the BEOL metal layers in silicon germanium heterojunction bipolar transistors (SiGe HBTs). The proposed technique is first tested on data generated using analytical equations and later validated with 3D TCAD simulation. The results clearly show that the exact contribution of the BEOL to the overall thermal resistance is captured in the proposed approach. Finally, we verified the method using measured data obtained from fabricated SiGe HBT structures using Infineon B11HFC technology. The extracted parameters show reasonable accuracy and consistency across different emitter dimensions and BEOL configurations.
dc.language.isoENen_US
dc.subject.enSiGe HBTs
dc.subject.enself heating
dc.subject.enthermal resistance
dc.subject.enback-end-of-line (BEOL)
dc.subject.enparameter extraction
dc.subject.encompact models
dc.title.enBEOL Thermal Resistance Extraction in SiGe HBTs
dc.typeArticle de revueen_US
dc.identifier.doi10.1109/TED.2022.3215715en_US
dc.subject.halSciences de l'ingénieur [physics]en_US
bordeaux.journalIEEE Transactions on Electron Devicesen_US
bordeaux.page6541-6546en_US
bordeaux.volume69en_US
bordeaux.hal.laboratoriesIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218en_US
bordeaux.issue12en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.peerReviewedouien_US
bordeaux.inpressnonen_US
bordeaux.import.sourcehal
hal.identifierhal-03846371
hal.version1
hal.exportfalse
workflow.import.sourcehal
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=IEEE%20Transactions%20on%20Electron%20Devices&rft.date=2022-10-27&rft.volume=69&rft.issue=12&rft.spage=6541-6546&rft.epage=6541-6546&rft.eissn=0018-9383&rft.issn=0018-9383&rft.au=NIDHIN,%20K.&BALANETHIRAM,%20Suresh&NAIR,%20Deleep&D'ESPOSITO,%20Rosario&MOHAPATRA,%20Nihar&rft.genre=article


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