High sensitivity and high resolution differential interferometer: Micrometric polariscope for thermomechanical studies in microelectronics
Language
en
Article de revue
This item was published in
Microelectronics Reliability. 1997-10, vol. 37, n° 10-11, p. 1587-1590
Elsevier
English Abstract
A high sensitivity and high resolution laser probe devoted to the thermomechanical studies of microelectronic interconnects has been developed. Surface displacements as low as 0.1 picometer (10−13m) can be observed, this ...Read more >
A high sensitivity and high resolution laser probe devoted to the thermomechanical studies of microelectronic interconnects has been developed. Surface displacements as low as 0.1 picometer (10−13m) can be observed, this allows the laser probe to investigate the edge effect in interconnects. The stress field induced by the edge forces in the underlying silicon dioxide layers has been observed. All measurements are performed with a micrometric lateral resolution.Read less <
Origin
Hal imported