ALDRETE-VIDRIO, Eduardo; MATEO, Diego; ALTET, Josep; SALHI, M. Amine; GRAUBY, Stéphane; DILHAIRE, Stefan; ONABAJO, Marvin; SILVA-MARTINEZ, Jose

doi:10.1088/0957-0233/21/7/075104

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ALDRETE-VIDRIO, Eduardo
Electronic Engineering Department

MATEO, Diego
Electronic Engineering Department

ALTET, Josep
Electronic Engineering Department

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Measurement Science and Technology. 2010-06-08, vol. 21, n° 7, p. 075104 (10)

IOP Publishing

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This paper presents two approaches to characterize RF circuits with built-in differential temperature measurements, namely the homodyne and heterodyne methods. Both non-invasive methods are analyzed theoretically and discussed with regard to the respective trade-offs associated with practical off-chip methodologies as well as on-chip measurement scenarios. Strategies are defined to extract the center frequency and 1 dB compression point of a narrow-band LNA operating around 1 GHz. The proposed techniques are experimentally demonstrated using a compact and efficient on-chip temperature sensor for built-in test purposes that has a power consumption of 15 μW and a layout area of 0.005 mm2 in a 0.25 μm CMOS technology. Validating results from off-chip interferometer-based temperature measurements and conventional electrical characterization results are compared with the on-chip measurements, showing the capability of the techniques to estimate the center frequency and 1 dB compression point of the LNA with errors of approximately 6% and 0.5 dB, respectively.< Leer menos

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integrated circuits

RF analog circuits

low-noise amplifier

CMOS differential temperature sensors

Michelson interferometer

homodyne method

heterodyne method

analog circuits characterization

RF built-in test

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Strategies for built-in characterization testing and performance monitoring of analog RF circuits with temperature measurements

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