Strategies for built-in characterization testing and performance monitoring of analog RF circuits with temperature measurements
Language
en
Article de revue
This item was published in
Measurement Science and Technology. 2010-06-08, vol. 21, n° 7, p. 075104 (10)
IOP Publishing
English Abstract
This paper presents two approaches to characterize RF circuits with built-in differential temperature measurements, namely the homodyne and heterodyne methods. Both non-invasive methods are analyzed theoretically and ...Read more >
This paper presents two approaches to characterize RF circuits with built-in differential temperature measurements, namely the homodyne and heterodyne methods. Both non-invasive methods are analyzed theoretically and discussed with regard to the respective trade-offs associated with practical off-chip methodologies as well as on-chip measurement scenarios. Strategies are defined to extract the center frequency and 1 dB compression point of a narrow-band LNA operating around 1 GHz. The proposed techniques are experimentally demonstrated using a compact and efficient on-chip temperature sensor for built-in test purposes that has a power consumption of 15 μW and a layout area of 0.005 mm2 in a 0.25 μm CMOS technology. Validating results from off-chip interferometer-based temperature measurements and conventional electrical characterization results are compared with the on-chip measurements, showing the capability of the techniques to estimate the center frequency and 1 dB compression point of the LNA with errors of approximately 6% and 0.5 dB, respectively.Read less <
English Keywords
integrated circuits
RF analog circuits
low-noise amplifier
CMOS differential temperature sensors
Michelson interferometer
homodyne method
heterodyne method
analog circuits characterization
RF built-in test
Origin
Hal imported