Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues
hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
dc.contributor.author | GRAUBY, Stéphane | |
hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
dc.contributor.author | SALHI, Amine | |
hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
dc.contributor.author | PATINO LOPEZ, Luis-David | |
hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
dc.contributor.author | CLAEYS, Wilfrid | |
hal.structure.identifier | Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés [TIMA] | |
dc.contributor.author | CHARLOT, Benoît | |
hal.structure.identifier | Centre de physique moléculaire optique et hertzienne [CPMOH] | |
dc.contributor.author | DILHAIRE, Stefan | |
dc.date.created | 2006-07-24 | |
dc.date.issued | 2008-02 | |
dc.identifier.issn | 0026-2714 | |
dc.description.abstractEn | We have studied temperature variations on two submicrometric dissipative structures with two different techniques. On one hand, we have used a thermoreflectance imaging technique which is a well-known non contact optical method to evaluate temperature variations but whose spatial resolution is limited by diffraction. On the other hand, we have used a scanning thermal microscope (SThM) to study the thermal behaviour of these small dissipative structures. We present qualitative results obtained by both methods and we compare their advantages and drawbacks in terms of calibration and spatial resolution for thermal measurements on microelectronic devices. In particular, we show how the thermoreflectance coefficient can become an advantage to enhance the image contrast and favour the spatial resolution. | |
dc.language.iso | en | |
dc.publisher | Elsevier | |
dc.title.en | Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues | |
dc.type | Article de revue | |
dc.identifier.doi | 10.1016/j.microrel.2007.04.008 | |
bordeaux.journal | Microelectronics Reliability | |
bordeaux.page | 204-211 | |
bordeaux.volume | 48 | |
bordeaux.issue | 2 | |
bordeaux.peerReviewed | oui | |
hal.identifier | hal-00747235 | |
hal.version | 1 | |
hal.popular | non | |
hal.audience | Nationale | |
hal.origin.link | https://hal.archives-ouvertes.fr//hal-00747235v1 | |
bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Microelectronics%20Reliability&rft.date=2008-02&rft.volume=48&rft.issue=2&rft.spage=204-211&rft.epage=204-211&rft.eissn=0026-2714&rft.issn=0026-2714&rft.au=GRAUBY,%20St%C3%A9phane&SALHI,%20Amine&PATINO%20LOPEZ,%20Luis-David&CLAEYS,%20Wilfrid&CHARLOT,%20Beno%C3%AEt&rft.genre=article |
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