Comparison of thermoreflectance and scanning thermal microscopy for microelectronic device temperature variation imaging: Calibration and resolution issues
CHARLOT, Benoît
Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés [TIMA]
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Techniques de l'Informatique et de la Microélectronique pour l'Architecture des systèmes intégrés [TIMA]
Idioma
en
Article de revue
Este ítem está publicado en
Microelectronics Reliability. 2008-02, vol. 48, n° 2, p. 204-211
Elsevier
Resumen en inglés
We have studied temperature variations on two submicrometric dissipative structures with two different techniques. On one hand, we have used a thermoreflectance imaging technique which is a well-known non contact optical ...Leer más >
We have studied temperature variations on two submicrometric dissipative structures with two different techniques. On one hand, we have used a thermoreflectance imaging technique which is a well-known non contact optical method to evaluate temperature variations but whose spatial resolution is limited by diffraction. On the other hand, we have used a scanning thermal microscope (SThM) to study the thermal behaviour of these small dissipative structures. We present qualitative results obtained by both methods and we compare their advantages and drawbacks in terms of calibration and spatial resolution for thermal measurements on microelectronic devices. In particular, we show how the thermoreflectance coefficient can become an advantage to enhance the image contrast and favour the spatial resolution.< Leer menos
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