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Elaboration by tape casting and hot rolling of copper/silicon carbide composite thin films for microelectronic applications

hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorGEFFROY, Pierre-Marie
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierAxe 1 : procédés céramiques
dc.contributor.authorCHARTIER, Thierry
dc.date.issued2007
dc.identifier.issn0255-5476
dc.description.abstractEnDuring the last decade, the use of metal matrix composites (MMCs) materials such as Al/SiC or CuW for microelectronic devices have made powder modules more reliable.
dc.language.isoen
dc.publisherTrans Tech Publications Inc.
dc.subject.enThermal conductivity
dc.subject.enComposites
dc.subject.enHot rolling
dc.subject.enTape casting
dc.subject.enCTE
dc.title.enElaboration by tape casting and hot rolling of copper/silicon carbide composite thin films for microelectronic applications
dc.typeArticle de revue
dc.identifier.doi10.4028/www.scientific.net/MSF.534-536.881
dc.subject.halChimie/Matériaux
bordeaux.journalMaterials Science Forum
bordeaux.page881-884
bordeaux.volume534-536
bordeaux.peerReviewedoui
hal.identifierhal-00122590
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00122590v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Materials%20Science%20Forum&rft.date=2007&rft.volume=534-536&rft.spage=881-884&rft.epage=881-884&rft.eissn=0255-5476&rft.issn=0255-5476&rft.au=GEFFROY,%20Pierre-Marie&SILVAIN,%20Jean-Fran%C3%A7ois&CHARTIER,%20Thierry&rft.genre=article


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