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hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorGEFFROY, Pierre-Marie
hal.structure.identifierAxe 1 : procédés céramiques
dc.contributor.authorCHARTIER, Thierry
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
dc.date.issued2007
dc.identifier.issn1438-1656
dc.description.abstractEnThe improved reliability and lifetime of electronic devices are important issues in packaging due to the increasing miniaturization of components in modern devices. Electron industry is therefore looking for the new adaptive materials such as metal matrix composites materials which present high thermal conductivity, low coefficient thermal expansion. This paper introduces the original process of elaboration of the metal matrix films by tape casting process and hot pressing.
dc.language.isoen
dc.publisherWiley-VCH Verlag
dc.subject.enMetal matrix composites
dc.subject.enTape casting
dc.subject.enThin films
dc.title.enInnovative approach to metal matrix composites film by tape casting process
dc.typeArticle de revue
dc.identifier.doi10.1002/adem.200700013
dc.subject.halChimie/Matériaux
bordeaux.journalAdvanced Engineering Materials
bordeaux.page547-553
bordeaux.volume9
bordeaux.issue7
bordeaux.peerReviewedoui
hal.identifierhal-00170289
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00170289v1
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