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hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
hal.structure.identifierUnité Matériaux et Transformations - UMR 8207 [UMET]
hal.structure.identifierInstitute of New Materials
dc.contributor.authorSHEN, Zhengyan
hal.structure.identifierUnité Matériaux et Transformations - UMR 8207 [UMET]
dc.contributor.authorJI, G
hal.structure.identifierUnité Matériaux et Transformations - UMR 8207 [UMET]
dc.contributor.authorADDAD, Ahmed
hal.structure.identifierPlateforme Aquitaine de Caractérisation des Matériaux [PLACAMAT]
dc.contributor.authorLABRUGÈRE, Christine
hal.structure.identifierDepartment of Electrical and Computer Engineering
dc.contributor.authorLU, Yongfeng
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
dc.date.issued2021
dc.identifier.issn0925-9635
dc.description.abstractEnAn Al matrix composite reinforced with 40 vol% graphite flake (Gf) was developed by powder metallurgy as a promising candidate for thermal management applications. Thermal conductivity (TC) along the orientation direction of the composite sintered at 640 °C was measured to be 452 W/m K, which is approximate to the highest TC value theoretically predicted by effective medium approximation model. The three underlying mechanisms responsible for such TC enhancement were clarified in terms of microstructure characterization. First, heat treatment of as-received Gf under Ar + H2 atmosphere resulted in reduction of defects on the edge contributing to improvement of interface thermal exchange efficiency between Al and Gf. Second, image analysis quantitatively confirmed that a step-by-step die filling process using the spherical powder ensures the perfect orientation of Gf in the Al matrix. Third, it was found that the TC of the composite increases with the sintering temperature from 580 to 640 °C. The formation of a small amount of fine platelet-like Al4C3 at the interface between the side surface of Gf and Al matrix indicates the desirable bonding state for minimizing interfacial thermal resistance, beneficial for the overall TC enhancement. Besides, the relevant coefficient of thermal expansion and bending strength were discussed.
dc.language.isoen
dc.publisherElsevier
dc.subject.enGraphite flake/Al composite materials
dc.subject.enThermal conductivity
dc.subject.enPowder filling process
dc.subject.enSintering
dc.title.enTailoring the microstructure of an oriented graphite flake/Al composite produced by powder metallurgy for achieving high thermal conductivity
dc.typeArticle de revue
dc.identifier.doi10.1016/j.diamond.2021.108513
dc.subject.halChimie/Matériaux
bordeaux.journalDiamond and Related Materials
bordeaux.page108513
bordeaux.volume118
bordeaux.peerReviewedoui
hal.identifierhal-03276773
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-03276773v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Diamond%20and%20Related%20Materials&rft.date=2021&rft.volume=118&rft.spage=108513&rft.epage=108513&rft.eissn=0925-9635&rft.issn=0925-9635&rft.au=SHEN,%20Zhengyan&JI,%20G&ADDAD,%20Ahmed&LABRUG%C3%88RE,%20Christine&LU,%20Yongfeng&rft.genre=article


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