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The Role of Sacrificial and/or Protective Layers to Improve the Sintering of Electroactive Ceramics: Application to Piezoelectric PZT-Printed Thick Films for MEMS

hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorDEBÉDA, Hélène
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorRUA-TABORDA, Maria-Isabel
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorSANTAWITEE, Onuma
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorGRALL, Simon
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorMAGLIONE, Mario
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorCHUNG, U-Chan
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorELISSALDE, Catherine
dc.date.issued2020-11-16
dc.identifier.issn2571-6131
dc.description.abstractEnPiezoelectric thick films are of real interest for devices such as ceramic Micro-ElectroMechanical Systems (MEMS) because they bridge the gap between thin films and bulk ceramics. The basic design of MEMS includes electrodes, a functional material, and a substrate, and efforts are currently focused on simplified processes. In this respect, screen-printing combined with a sacrificial layer approach is attractive due to its low cost and the wide range of targeted materials. Both the role and the nature of the sacrificial layer, usually a carbon or mineral type, depend on the process and the final device. First, a sacrificial layer method dedicated to screen-printed thick-film ceramic and LTCC MEMS is presented. Second, the recent processing of piezoelectric thick-film ceramic MEMS using spark plasma sintering combined with a protective layer approach is introduced. Whatever the approach, the focus is on the interdependent effects of the microstructure, chemistry, and strain/stress, which need to be controlled to ensure reliable and performant properties of the multilayer electroceramics. Here the goal is to highlight the benefits and the large perspectives of using sacrificial/protective layers, with an emphasis on the pros and cons of such a strategy when targeting a complex piezoelectric MEMS design.
dc.language.isoen
dc.publisherMDPI
dc.subject.ensacrificial layer
dc.subject.enprotective layer
dc.subject.enthick film
dc.subject.enscreen-printing
dc.subject.enspark plasma sintering
dc.subject.enpiezoelectric
dc.subject.encarbonate
dc.title.enThe Role of Sacrificial and/or Protective Layers to Improve the Sintering of Electroactive Ceramics: Application to Piezoelectric PZT-Printed Thick Films for MEMS
dc.typeArticle de revue
dc.identifier.doi10.3390/ceramics3040038
dc.subject.halChimie/Matériaux
dc.subject.halSciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique
bordeaux.journalCeramics
bordeaux.page453-475
bordeaux.volume3
bordeaux.issue4
bordeaux.peerReviewedoui
hal.identifierhal-03009101
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-03009101v1
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