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hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorVINCENT, Cécile
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorHEINTZ, Jean-Marc
hal.structure.identifierCollege of Engineeriing
dc.contributor.authorCHANDRA, Namas
dc.date.issued2011
dc.identifier.issn2164-5612
dc.description.abstractEnThermal dissipation in power electronic devices can be improved through the elaboration of a new generation of layered heat sinks based on copper (Cu) -carbon nanofibers (CNF) composites. Though the high theoretical thermal conductivity of CNF (1200 W/m.K) no Cu-CNF composites with enhanced thermal properties are available. Indeed conventional compositing processes do not allow neither a good dispersion of the nano-reinforcements nor a control of the nanofiber-matrix interface which is not suitable for efficient heat transfers. In this paper, a process based on CNF coating with Cu followed by uniaxial hot pressing in described. It is shown that under proper experimental conditions the salt decomposition coating method is capable of achieving the desired high thermal conductivity values (> 400 W/m.K) thanks to a good dispersion of the CNF, low porosity content and the control of Cu-CNF interfaces.
dc.language.isoen
dc.publisherScientific Research Publishing
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/
dc.subject.enCarbon Nanofibers
dc.subject.enMetal Matrix Composite
dc.subject.enPowder Processing
dc.subject.enThermal Properties
dc.typeArticle de revue
dc.identifier.doi10.4236/ojcm.2011.11001
dc.subject.halChimie/Matériaux
bordeaux.journalOpen Journal of Composite Materials
bordeaux.volume1
bordeaux.issue1
bordeaux.peerReviewedoui
hal.identifierhal-00641708
hal.version1
hal.popularnon
hal.audienceInternationale
dc.title.itCu/CNF nanocomposite processed by novel salt decomposition method
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00641708v1
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