Show simple item record

hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorFOUASSIER, Olivier
hal.structure.identifierTHALES Airborne Systems [Elancourt]
dc.contributor.authorCHAZELAS, Jean
hal.structure.identifierInstitut de Chimie de la Matière Condensée de Bordeaux [ICMCB]
dc.contributor.authorSILVAIN, Jean-François
dc.date.issued2002
dc.identifier.issn1359-835X
dc.description.abstractEnCopper coated NiTi particles have been incorporated into a lead free solder paste in order to improve mechanical performances of solder joints. In order to optimise the thickness of the copper coating, interfacial reactions between Sn-3.8Ag-0.7Cu (wt%) and copper substrate have been studied. Auger Electron Spectroscopy linescan profile across the copper substrate and the Sn-3.8Ag-0.7Cu matrix interface has shown that the reaction layer is composed of Cu3Sn and Cu6Sn5 intermetallics. The formation and growth of this layer has been discussed. Finally the diffusion constant and activation energy for the diffusion of copper in the liquid and solid Sn-3.8Ag-0.7Cu matrix have been determined.
dc.language.isoen
dc.publisherElsevier
dc.subject.enLead-free solder
dc.subject.enNickel titanium (NiTi)
dc.subject.enShape memory alloy
dc.subject.enMetal matrix composite
dc.subject.enElectroless copper coating
dc.subject.enInterfacial study
dc.typeArticle de revue
dc.identifier.doi10.1016/S1359-835X(02)00154-9
dc.subject.halChimie/Matériaux
bordeaux.journalComposites Part A: Applied Science and Manufacturing
bordeaux.page1391-1395
bordeaux.volume33
bordeaux.issue10
bordeaux.peerReviewedoui
hal.identifierhal-00817141
hal.version1
hal.popularnon
hal.audienceInternationale
hal.origin.linkhttps://hal.archives-ouvertes.fr//hal-00817141v1
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=Composites%20Part%20A:%20Applied%20Science%20and%20Manufacturing&rft.date=2002&rft.volume=33&rft.issue=10&rft.spage=1391-1395&rft.epage=1391-1395&rft.eissn=1359-835X&rft.issn=1359-835X&rft.au=FOUASSIER,%20Olivier&CHAZELAS,%20Jean&SILVAIN,%20Jean-Fran%C3%A7ois&rft.genre=article


Files in this item

FilesSizeFormatView

There are no files associated with this item.

This item appears in the following Collection(s)

Show simple item record