Electroless deposition of copper on to alumina sub-micronic powders and sintering
Language
en
Article de revue
This item was published in
Composites Part A: Applied Science and Manufacturing. 2002, vol. 33, n° 10, p. 1387-1390
Elsevier
English Abstract
This work has been initiated in order to find new routes for the preparation of 3D interconnected ceramic-metal composites, usually obtained by direct metal oxidation or liquid infiltration of a ceramic preform. The system ...Read more >
This work has been initiated in order to find new routes for the preparation of 3D interconnected ceramic-metal composites, usually obtained by direct metal oxidation or liquid infiltration of a ceramic preform. The system under investigation is the alumina-copper system. The key point of this new route was the preparation of very fine composite powders, which allowed the material to be densified by natural sintering. The first part of the presentation deals with the preparation of the composite powders, which was achieved using an electroless process. Influence of experimental parameters controlling the deposition of a copper layer on a sub-micronic alumina powder was investigated. The second part deals with the processing of the composite. A statistical design methodology was applied to determine the main parameters controlling the shrinkage. For some conditions, a new in situ Cu-CuAlO2 composite is formed, which presents an interesting microstructure with CuAlO2 acicular grains.Read less <
English Keywords
Sintering
Al2O3-Cu
Composite powders
Electroless process
Origin
Hal imported