A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices
| dc.rights.license | open | en_US |
| dc.contributor.author | SCOGNAMILLO, Ciro | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | FREGONESE, Sebastien | |
| hal.structure.identifier | Laboratoire de l'intégration, du matériau au système [IMS] | |
| dc.contributor.author | ZIMMER, Thomas
IDREF: 076632598 | |
| dc.contributor.author | DAALESSANDRO, Vincenzo | |
| dc.contributor.author | CATALANO, Antonio Pio | |
| dc.date.accessioned | 2022-07-11T09:15:00Z | |
| dc.date.available | 2022-07-11T09:15:00Z | |
| dc.date.issued | 2022-10 | |
| dc.identifier.issn | 0885-8993 | en_US |
| dc.identifier.uri | oai:crossref.org:10.1109/tpel.2022.3174617 | |
| dc.identifier.uri | https://oskar-bordeaux.fr/handle/20.500.12278/140422 | |
| dc.description.abstractEn | In this letter, an innovative technique is presented, which allows the experimental extraction of the junction-to-ambient thermal impedance (ZTH) of power devices operating in their application environment (in situ). The technique draws inspiration from the thermal characterization of RF transistors, and is based on simple measurements of electrical signals, while not requiring a thermochuck, the calibration of a thermometer, as well as temperature sensors or IR cameras. The validation of the technique is unambiguously performed by applying the “simulated experiments” strategy on an SiC-based multichip power module. | |
| dc.language.iso | EN | en_US |
| dc.source | crossref | |
| dc.subject.en | Electrothermal (ET) simulation | |
| dc.subject.en | finite-element method simulation | |
| dc.subject.en | in-situ thermal characterization | |
| dc.subject.en | power devices | |
| dc.subject.en | thermal impedance (Z $_{\mathrm {TH}}$ ) measurement | |
| dc.title.en | A Technique for the In-Situ Experimental Extraction of the Thermal Impedance of Power Devices | |
| dc.type | Article de revue | en_US |
| dc.identifier.doi | 10.1109/tpel.2022.3174617 | en_US |
| dc.subject.hal | Sciences de l'ingénieur [physics]/Automatique / Robotique | en_US |
| bordeaux.journal | IEEE Transactions on Power Electronics | en_US |
| bordeaux.page | 11511-11515 | en_US |
| bordeaux.volume | 37 | en_US |
| bordeaux.hal.laboratories | Laboratoire d’Intégration du Matériau au Système (IMS) - UMR 5218 | en_US |
| bordeaux.issue | 10 | en_US |
| bordeaux.institution | Université de Bordeaux | en_US |
| bordeaux.institution | Bordeaux INP | en_US |
| bordeaux.institution | CNRS | en_US |
| bordeaux.peerReviewed | oui | en_US |
| bordeaux.inpress | non | en_US |
| bordeaux.import.source | dissemin | |
| hal.export | false | |
| workflow.import.source | dissemin | |
| dc.rights.cc | Pas de Licence CC | en_US |
| bordeaux.COinS | ctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.jtitle=IEEE%20Transactions%20on%20Power%20Electronics&rft.date=2022-10&rft.volume=37&rft.issue=10&rft.spage=11511-11515&rft.epage=11511-11515&rft.eissn=0885-8993&rft.issn=0885-8993&rft.au=SCOGNAMILLO,%20Ciro&FREGONESE,%20Sebastien&ZIMMER,%20Thomas&DAALESSANDRO,%20Vincenzo&CATALANO,%20Antonio%20Pio&rft.genre=article |
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