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dc.rights.licenseopenen_US
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorROMDHANE, E. Ben
hal.structure.identifierIRT Saint Exupéry - Institut de Recherche Technologique
dc.contributor.authorROUMANILLE, P.
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorGUEDON-GRACIA, A.
hal.structure.identifierIRT Saint Exupéry - Institut de Recherche Technologique
dc.contributor.authorPIN, S.
hal.structure.identifierIRT Saint Exupéry - Institut de Recherche Technologique
dc.contributor.authorNGUYEN, P.
hal.structure.identifierLaboratoire de l'intégration, du matériau au système [IMS]
dc.contributor.authorFREMONT, H.
dc.date.accessioned2022-07-08T07:55:29Z
dc.date.available2022-07-08T07:55:29Z
dc.date.issued2022
dc.date.conference2022-04-25
dc.identifier.urihttps://oskar-bordeaux.fr/handle/20.500.12278/140398
dc.description.abstractEnAs lead-free solder joints mechanical behavior is dependent on their microstructural characteristics, locations and geometries, developing accurate solder joint fatigue models implies correctly identifying the microstructural changes that undergo the solder alloy during thermal cycling. The present work aims at evaluating thermomechanical SAC (Sn-Ag-Cu) solder joints reliability by studying different types of components. Lifetimes data coupled to the microstructural investigation allowed us to study the microstructural process leading to SAC solder joints failure and to identify the different factors that must be considered in Finite Element Models (FEM) of electronic lead-free assemblies under thermomechanical loading. Tin recrystallization and strain-enhanced precipitate coarsening led to intergranular cracking in the solder joints, which was the first identified failure mode. A brittle interfacial crack that does not need tin grain recrystallization to propagate was the second detected cracking mode. The different behavior of one solder joint compared to another can be explained either by the presence of an unexpected microstructure highlighted during the characterization of the as-reflowed solder or by the design and the materials properties that unify each package.
dc.language.isoENen_US
dc.publisherIEEEen_US
dc.subject.enGeometry
dc.subject.enThermomechanical processes
dc.subject.enFailure analysis
dc.subject.enTin
dc.subject.enLead
dc.subject.enFatigue
dc.subject.enFinite element analysis
dc.title.enEvaluation of SAC solder joint thermomechanical fatigue in different types of components
dc.typeCommunication dans un congrès avec actesen_US
dc.identifier.doi10.1109/EuroSimE54907.2022.9758868en_US
dc.subject.halSciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectroniqueen_US
bordeaux.page1-6en_US
bordeaux.hal.laboratoriesLaboratoire d’Intégration du Matériau au Système (IMS) - UMR 5218en_US
bordeaux.institutionUniversité de Bordeauxen_US
bordeaux.institutionBordeaux INPen_US
bordeaux.institutionCNRSen_US
bordeaux.conference.titleInternational Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)en_US
bordeaux.countrymten_US
bordeaux.title.proceeding2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)en_US
bordeaux.conference.citySt Julianen_US
bordeaux.peerReviewedouien_US
bordeaux.import.sourcehal
hal.identifierhal-03665823
hal.version1
hal.exportfalse
workflow.import.sourcehal
dc.rights.ccPas de Licence CCen_US
bordeaux.COinSctx_ver=Z39.88-2004&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.date=2022&rft.spage=1-6&rft.epage=1-6&rft.au=ROMDHANE,%20E.%20Ben&ROUMANILLE,%20P.&GUEDON-GRACIA,%20A.&PIN,%20S.&NGUYEN,%20P.&rft.genre=proceeding


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