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  • Dynamics of corrosion on mechanical and electrical reliability of SAC305 solder joints during salt spray test 

    AKODA, Komlan Elom; GUEDON-GRACIA, Alexandrine; DELETAGE, Jean-Yves ...
    Communication dans un congrès
  • 2D Model for moisture diffusion in integrated Low-k dielectrics 

    MISCHLER, Leo; CARTAILLER, Vivien; DUCHAMP, Genevieve ...
    (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)
    Communication dans un congrès avec actes
  • Review—Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements 

    MOREAU, S.; JOURDON, Joris; LHOSTIS, S. ...
    (ECS Journal of Solid State Science and Technology. vol. 11, n° 2, pp. 024001, 2022-02-01)
    Article de revue
  • Epoxy Mold Compound Characterization for Modeling Packaging Reliability 

    TOMAS, Ariane; LAMBERT, Benoit; FREMONT, Helene ...
    (2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)
    Communication dans un congrès avec actes
  • QFN (Quad Flat No–lead) SAC Solder Joints under Thermal Cycling: Identification of Two Failure Mechanisms 

    BEN ROMDHANE, E.; ROUMANILLE, P.; GUEDON-GRACIA, Alexandrine ...
    (2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), 72nd Electronic Components and Technology Conference (ECTC), us, San Diego, 2022-05-01)
    Communication dans un congrès avec actes
  • New Method to Perform TDDB Tests for Hybrid Bonding Interconnects 

    AYOUB, Bassel; MOREAU, S.; LHOSTIS, S. ...
    (2022 IEEE International Reliability Physics Symposium (IRPS), International Reliability Physics Symposium (IRPS), us, Dallas, 2022-03)
    Communication dans un congrès avec actes
  • Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction 

    AYOUB, Bassel; HOUSSAINI, Faycal; MOREAU, Stephane ...
    (Workshop Correlative Materials Characterization, Workshop Correlative Materials Characterization, de, Dresde, 2022-10)
    Autre communication scientifique (congrès sans actes - poster - séminaire...)
  • Moisture Diffusion Inside the BEOL of an FC-PBGA Package 

    VANDIER, Quentin; FREMONT, Helene; DROUIN, Dominique
    (IEEE Transactions on Components, Packaging and Manufacturing Technology. vol. 12, n° 11, pp. 1740-1747, 2022-11)
    Article de revueOpen access
  • Sub 1 μm Pitch Achievement for Cu/SiO2 Hybrid Bonding 

    AYOUB, Bassel; LHOSTIS, Sandrine; MOREAU, Stephane ...
    (24th Electronics Packaging Technology Conference, 24th Electronics Packaging Technology Conference Singapore | Dec 7-9, 2022, sg, Singapour, 2023-01-18)
    Communication dans un congrès avec actes
  • Thermomechanical Characterizations of Copper at Nanoscale by Laue Microdiffraction 

    AYOUB, Bassel; LHOSTIS, Sandrine; MOREAU, Stephane ...
    (Satellite European School for Young Scientists Microscopy and Materials Characterization, Satellite European School for Young Scientists Microscopy and Materials Characterization, de, Dresde, 2022-10-12)
    Autre communication scientifique (congrès sans actes - poster - séminaire...)Open access

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Has File(s)No (21)Yes (2)Author
FREMONT, Helene (23)
AYOUB, Bassel (9)LHOSTIS, Sandrine (7)MOREAU, Stephane (7)GUEDON-GRACIA, Alexandrine (4)... View MorePublication date2023 (9)2022 (8)2024 (5)2025 (1)Document typeCommunication dans un congrès (11)Article de revue (5)Communication dans un congrès avec actes (5)Autre communication scientifique (congrès sans actes - poster - séminaire...) (2)StructureIMS : Laboratoire de l'Intégration du Matériau au Système - UMR 5218 (16)Laboratoire d’Intégration du Matériau au Système (IMS) - UMR 5218 (5)IMS : Laboratoire d’Intégration du Matériau au Système - UMR 5218 (2)InstitutionBordeaux INP (23)CNRS (23)Université de Bordeaux (23)HAL DomainSciences de l'ingénieur [physics] (18)Sciences de l'ingénieur [physics]/Micro et nanotechnologies/Microélectronique (3)Sciences de l'ingénieur [physics]/Autre (1)Sciences de l'ingénieur [physics]/Mécanique [physics.med-ph] (1)

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