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A 5G 65-nm PD-SOI CMOS 23.2-to-28.8 GHz Low-Jitter Quadrature-Coupled Injection-Locked Digitally-Controlled Oscillator
Communication dans un congrès -
Thermal Modelling and Power Consumption Estimation of a Multi Floor Small Scale Building Using SPICE Simulator
(WSEAS Transactions on Environment and Development. vol. 18, pp. 315-321, 2022-02-09)Article de revueOpen access -
A New Approach in the Field of Hydrogen Gas Sensing Using MEMS Based 3C-SiC Microcantilevers
(13th European Conference on Silicon Carbide and Related Materials, ECSCRM 2020·2021, fr, Tours, 2022-05-31)Communication dans un congrès avec actesOpen access -
H2MEMS Project: Resonant MEMS for Detection of Hydrogen Release in Radioactive Waste Disposal Facility1
(H2MEMS Project: Resonant MEMS for detection of hydrogen release in radioactive waste disposal facility, 2022 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS), fr, Paris, 2022-04)Communication dans un congrès avec actesOpen access -
Chemical sensor based on a novel capacitive microwave flexible transducer with polymer nanocomposite-carbon nanotube sensitive film
(Microsystem Technologies. vol. 28, pp. 1365-1378, 2022-06)Article de revue -
A 40 GHz Varactor-less Class-C VCO with 17.1% Tuning Range and Long-Term Reliability in 28nm FD-SOI for Satellite Communications
Communication dans un congrès -
Vertical Organic Electrochemical Transistors and Electronics for Low Amplitude Micro‐Organ Signals
(Advanced Science. vol. 9, n° 8, pp. 2105211, 2022-01)Article de revueOpen access -
In-situ characterization of thermomechanical behavior of copper nano-interconnect for 3D integration
(Microelectronic Engineering. vol. 261, pp. 111809, 2022-05)Article de revue -
Screen-Printed Microcantilevers Coated with Functionalized Mesocellular Foam Silica for Detection of Solvent Vapors
(IEEE Sensors Journal. pp. 1-1, 2022-01-01)Article de revue -
Dynamics of the corrosion for SAC305 solder alloy in salt environment
(2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), mt, St Julian, 2022)Communication dans un congrès avec actes